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  • G. Parry, “HDI Design – A Manufactures Point of View”, IPC HDI Technology Exchange, Dallas TX, October 7, 2008
  • G. Parry, “HDI Implementation for Aerospace/Military Applications” IPC Technology Interchange, Washington DC., December 10, 2009
  • G. Parry, “Thermal Management; HDI and MicroVias” IPC Technology Interchange on Thermal Management, Irvine CA., November 3, 2010
  • G. Parry, P. Cooke, A. Caputo, L. J. Turbini, “The effect of manufacturing parameters on board design on CAF evaluation,” International Conference on Lead-free Soldering,” Toronto, Ontario, May 26,2005
  • G. Parry, P. Reid, P. Andrews, “ Microvia Reliability; Concerns in the Lead Free Assembly Environment” Proceedings of IPC Works International Conference, Las Vegas, October 26, 2005

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