Many North American PCB manufacturers are utilizing Asia based CADCAM groups to perform front end engineering and tooling.

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Paul Langston – President and principal

I bring to the company more than 25 years of leadership and execution experience within the  PCB industry.  My primary focus is to guide the company’s  PCB  and related interconnects strategy according to customer need as well as develop the associated manufacturing relationships in Asia and North America. 

Prior to starting  in 2012 , I spent 25 years as the founder, President and CEO of Coretec Inc. growing the company to $100 million in annual revenues with 700 employees across operations in Canada, the USA, the UK and  China. Coretec was one of the largest designers and manufacturers of PCBs in North America with particular emphasis on high reliability end markets - namely the defense, aerospace, medical, heavy industrial, telecom infrastructure and oil/gas sectors. 

From 2004-2009  I was Vice-Chair of IPC, a US-based global electronics industry association, supporting the electronic materials, PCB, EMS and electronic component industries.  As well, I have acted as a director for private and public organizations in the electronics industry as well as several not-for-profit organizations. I have also been an active member of Young Presidents' Organization (YPO/WPO) since 1993.

Gareth Parry – Principal

At I have responsibility for the value-added advisory practice in addition to acting as the primary technical conduit between our customers and our Asian and North American PCB manufacturing partners.    

Our customers consider me to be an excellent resource for PCB knowledge management, application engineering, design optimization and technology guidance.  With respect to our PCB supply partners my focus is to align business opportunities to the their respective technology capability and product focus.  Furthermore, I am the principal architect of the quality assurance strategy which includes new vendor qualifications, on-going re-audits of existing partners as well as source inspection protocols for product prior to shipment.   

Prior to I  spent the past 25 years in the PCB industry, most recently as Chief Technology Officer for Coretec Inc., one of North America’s largest PCB manufacturers. As CTO I had ownership for all aspects of the company’s technology direction, including R&D, CAD design, field applications engineering, front-end CAM and product engineering as well as process engineering.  I was also a key strategist for Coretec’s Asia joint venture activity which today, is directly relevant to my responsibilities at .  

As a member of the Association of Professional Engineers of Ontario and through my industry involvement, I frequently contribute to technical trade papers and industry publications.